Looking for Engineering Talent in Chip Technology: Advanced Packaging

Are you a young talented (to-be) engineer? Learn about the career possibilities within Twente! On the 5th of October our second session of the series “Looking for Engineering Talent” will take place. The event will take place at Saxion University of Applied Science as a hybrid webinar about advanced packaging (e.g. photonic packaging) in the chip technology industry of Twente. Only students and young professionals will be able to attend in person.

Speakers

Roy de Kinkelder (PDNL Learning Center) has an education background in biomedical engineering at University Twente and studied Applied Physics at Saxion. He is a senior researcher and lecturer in Applied Nanotechnology at Saxion University of Applied Sciences, with a strong background in micro-assembly and precision engineering. He is currently part of the initiative of developing a new PDNL Learning Center. In this role he focuses on identifying the specific technical and practical skills required to work in the rapidly growing integrated photonics sector

Gijs van Ouwerkerk (PhiX) has an education background in mechanical engineering at University Twente. As marketing manager of PhiX, a world-leading photonic chip packaging contract manufacturer, he is responsible for the company’s visibility for potential customers, industry partners, and job seekers. With his background and current role, he answer the question What is advanced packaging about?

Programme

This event is organized in collaboration with KIVI and PhotonDelta.